обновлено 5 дней назад
Software Architect (3DIC & AI-driven EDA Automation)
178 500 - 331 500$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Software Architect (3DIC & AI-driven EDA Automation): Building scalable EDA flows and AI-driven automation for advanced 3DIC, interposer, and RDL system flows with an accent on flow generation, debugging assistance, root-cause analysis, and platform integration. Focus on designing constraint-driven workflows, integrating large-scale package and system-level design flows, and developing LLM-based prompt-to-script automation.
Location: San Jose, California, United States
Salary: $178,500–$331,500 annually, plus potential bonus, equity, and benefits.
Company
develops electronic design automation software and platforms for advanced semiconductor and system design.
What you will do
- Build scalable EDA flows using C++, Tcl, Python, and Java.
- Develop AI and LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis.
- Integrate 3DIC flows into platform systems supporting interposer and RDL system flows.
- Design workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
- Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.
Requirements
- Strong background in EDA data structures and algorithms.
- Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
- Experience with database-driven design flows such as Innovus or similar implementation platforms.
- Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
- Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
- Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field, with relevant industry experience.
Nice to have
- Experience with 3DIC, 3.5D, or 2.5D designs.
- Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging.
- Experience with LLM or AI systems, agent frameworks, and prompt-to-script automation.
- Knowledge of multi-tool integration and end-to-end flow automation.
Culture & Benefits
- Full-time employment with paid vacation and holidays.
- 401(k) plan with employer match.
- Employee stock purchase plan.
- Medical, dental, and vision plan options.
- Potential incentive compensation through bonus and equity.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →
Похожие вакансии
3 дня назад
Development Tools Software Arch (SoC)
173 660 - 245 160$
4 дня назад
Senior Static Timing Analysis Methodology Lead Engineer / Technical Lead (ASIC/EDA)
187 000 - 270 000$
5 дней назад
Software Enabling and Optimization Architect
149 600 - 284 580$
1 день назад
Senior Director, Architecture Research Lab (AI)
246 000 - 430 000$
7 часов назад
Principal Software Architect (AI)
168 000 - 210 000$
3 часа назад
Principal Architect - AI Product Engineering (AI)
158 200 - 217 300$