Director, Silicon Design Engineering (Physical Design)

TL;DR

Director, Silicon Design Engineering (Physical Design): Leading the delivery of next-generation SoC products with an accent on timing analysis, power efficiency, and performance optimization. Focus on driving advanced methodologies, collaborating with cross-functional architecture and clocking teams, and ensuring high-performance silicon integration.

Location: Must be based in the US (Santa Clara, CA; Hillsboro, OR; or Austin, TX). This role follows a hybrid work model.

Salary: $220,920–$311,890 USD

Company

hirify.global is a global leader in semiconductor technology, building scalable engineering solutions across product enablement, custom ASIC, and foundry services.

What you will do

• Perform comprehensive timing analysis and optimization to ensure robust, high-performance SoC designs.
• Generate and validate timing constraints while addressing violations at chip and block levels.
• Develop and implement methodologies to produce high-quality timing models for the physical design team.
• Define PVT conditions tailored to product operating plans and binning requirements.
• Collaborate with clocking and logic design teams to optimize power delivery, partitioning, and clock network balance.
• Drive flow development for seamless chip integration and adherence to low-power guidelines.

Requirements

• Must be based in the US (eligible for hybrid work at hirify.global sites).
• Bachelor's degree in Electrical or Computer Engineering (or related field).
• 12+ years of experience (with Bachelor's), 8+ years (with Master's), or 6+ years (with PhD) in timing analysis or physical design.
• Proficiency in static timing analysis, constraint generation, and optimization techniques.
• Strong knowledge of SoC clocking, timing budgeting, and scripting (TCL).
• Experience with physical design tools, flows, and methodologies (TFM).

Nice to have

• Exposure to signal and power integrity analysis.
• Experience with advanced process nodes and industry-leading EDA tools.
• Proven ability to lead and collaborate with cross-functional architecture and logic design teams.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Hybrid work model allowing flexibility between on-site and off-site work.
• Opportunity to work on cutting-edge semiconductor innovations with global impact.