Laser Development Engineer (Semiconductor)

TL;DR

Laser Development Engineer (Semiconductor): Designing and developing advanced laser assembly packaging processes and equipment with an accent on process characterization, reliability, and yield optimization. Focus on applying statistical methodologies and engineering principles to solve complex manufacturing challenges in a high-tech semiconductor environment.

Location: On-site in Phoenix, Arizona, USA

Salary: $115,110–$219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in silicon process and advanced packaging technology for the AI era.

What you will do

• Design and develop laser assembly packaging processes and equipment for next-generation technologies.
• Optimize manufacturing processes to meet stringent quality, reliability, cost, and yield requirements.
• Develop process specifications using Design of Experiments (DOE) and data analysis.
• Establish laser process reliability requirements based on failure mechanism analysis.
• Collaborate with cross-functional teams and suppliers to standardize qualification procedures and manufacturing systems.
• Innovate new techniques and quality screens for early identification of packaging reliability issues.

Requirements

• Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or related STEM field with 4+ years of industry experience (or Master's with 3+ years, or PhD with 6+ months).
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).
• Strong analytical skills with expertise in data analysis and risk assessment.
• Demonstrated experience applying engineering principles to develop laser solutions for packaging.
• Must be able to work on-site in Phoenix, Arizona.

Nice to have

• Hands-on experience in semiconductor manufacturing or laser-based equipment troubleshooting.
• Familiarity with equipment adjustment and process characterization.
• Ability to use data science tools such as Python, NumPy, Pandas, SQL, JMP, or Minitab.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work at the forefront of semiconductor packaging innovation.
• Collaborative environment focused on global manufacturing scale and technological leadership.