Advanced Packaging Process Integration Engineer (Semiconductor)

TL;DR

Advanced Packaging Process Integration Engineer (Semiconductor): Driving technology transfer and yield improvement for advanced packaging and backend assembly processes with an accent on data-driven analysis and manufacturing excellence. Focus on defining process flows, resolving yield excursions, and mentoring technical talent to ensure high-volume manufacturing success.

Location: Must be based on-site in Albuquerque, New Mexico, USA

Salary: $120,860–$170,630 USD

Company

A global leader in semiconductor manufacturing, technology development, and foundry services powering the AI era.

What you will do

• Define and establish process flows, procedures, and equipment configurations for technology transfer.
• Analyze structured and unstructured data using SQL and Python to extract actionable insights.
• Drive yield improvement initiatives and resolve low-yield issues through cross-functional collaboration.
• Implement continuous improvement programs to prevent quality and yield excursions.
• Perform quality and reliability risk assessments for manufacturing materials and process changes.
• Mentor and develop technical talent to foster a culture of innovation.

Requirements

• Bachelor's degree in Engineering, Material Science, Physics, or related field with 4+ years of experience (or Master's with 3+ years, or PhD with 0+ years).
• Experience in process integration, yield analysis, and quality management in TD or high-volume manufacturing.
• Expertise in semiconductor advanced packaging and backend assembly-test process development.
• Must be able to work on-site in Albuquerque, New Mexico.

Nice to have

• Proven ability to lead cross-functional problem-solving initiatives.
• Strong communication skills for stakeholder collaboration.
• Experience in value engineering and cost-effective solution identification.

Culture & Benefits

• Competitive total compensation package including pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on cutting-edge semiconductor technology at a global scale.
• Collaborative environment focused on innovation and professional development.