Co-Packaged Optics Packaging Process Development Engineer (AI)

TL;DR

Co-Packaged Optics Packaging Process Development Engineer (AI): Driving AI products from concept to high-volume manufacturing with an accent on assembly process technology development and partner management. Focus on 2.5D/3D CoW assembly, wafer process development, and maturing products through the NPI phase.

Location: Santa Clara, CA

Salary: $141,150 - $211,400 per annum

Company

hirify.global's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world.

What you will do

• Lead process development at foundries and 2.5D/3D CoW process development.
• Manage chemistry development with packaging consumable suppliers at OSATs.
• Drive packaging solutions from concept to prototypes and ramp to high-volume manufacturing (HVM).
• Manage qualification of packages for high thermo-mechanical reliability.
• Drive ideation and innovation of advanced package solutions and specifications.

Requirements

• 10+ years of experience in Semiconductor Packaging, Process, and Technology Development.
• M.S or Ph.D in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.
• Expertise in advanced packaging technologies, including TSVs and various 2.5D/3D package form factors.
• Proven track record of bringing products from Technology development through NPI to HVM.
• Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Nice to have

• Experience with photonics packaging.

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Family support programs to help balance work and home life.
• Robust mental health resources to prioritize emotional well-being.
• Recognition and service awards to celebrate contributions and milestones.