Staff Packaging Engineer (Semiconductor)

TL;DR

Staff Packaging Engineer (Semiconductor): Managing mass production of multi-die wirebond leadframe packages at an OSAT partner with an accent on sustaining manufacturing performance and supplier process control. Focus on root-cause analysis of yield excursions, implementing robust RTM protocols, and driving SPC for critical assembly steps.

Location: Must be based full-time at the OSAT site in Ayutthaya, Thailand with occasional travel to Penang, Malaysia

Company

hirify.global is a leading supplier of high-voltage power conversion solutions.

What you will do

• Act as the on-site technical owner and primary interface between OSAT operations and internal packaging/product teams.
• Troubleshoot production issues and lead root-cause analysis (8-D, RCA) for quality holds and yield excursions.
• Implement RTM artifacts including process flows, control plans, and SOPs.
• Define and maintain SPC (Cp/Cpk) and guardbanding for die attach, wirebond, and molding.
• Manage supplier change control (PCN), BOM releases, and perform quality audits.
• Conduct DOE and process characterization to optimize yield, capacity, and cycle time.

Requirements

• B.S. in Electrical, Mechanical, Materials, Chemical engineering or related field.
• Minimum of 8 years’ experience in semiconductor back-end assembly in a volume production environment.
• Proficiency in wirebond processes, leadframe design, clip bonding, and encapsulation.
• Expertise in problem-solving methodologies: 8-D, FMEA, DOE, and SPC.
• Experience with QC/FA tools such as SEM, X-ray, cross-section, and decap.
• Ability to be based full-time in Ayutthaya, Thailand.

Nice to have

• Experience with power packages or automotive qualification (AEC).
• Knowledge of APQP development processes and JEDEC/IPC standards.
• Ability to coordinate with colleagues in US timezones.