Engineer II (Die Attach/Die Bond/Wire Bond) (Semiconductor)

TL;DR

Engineer II (Die Attach/Die Bond/Wire Bond) (Semiconductor): Ownership of process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel semiconductor assembly line with an accent on equipment uptime, process stability, and yield improvement. Focus on optimizing bonding parameters, conducting root cause analysis for yield issues, and leading new product introductions.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer specializing in discrete components and logic.

What you will do

• Own and sustain Die Attach and Wire Bond processes to ensure stable operation and high OEE.
• Manage tooling setup, calibration, and qualification activities.
• Perform DOE, FMEA, and root cause analysis to resolve quality issues like die tilt and wire lift.
• Lead new product introductions (NPI), including setup and material qualification.
• Analyze performance data using Spotfire, Power BI, and Excel to drive cost reduction.
• Document SOPs and provide technical mentoring to technicians and operators.

Requirements

• Bachelor's degree in Mechanical, Electrical, Electronics, or Mechatronics Engineering.
• 2–3 years of hands-on experience in Die Bond/Wire Bond within semiconductor backend manufacturing.
• Strong understanding of Reel-to-Reel (R2R) assembly and high-volume production.
• Proficiency in DOE, FMEA, SPC, 8D, and Cpk analysis.
• Ability to analyze manufacturing data using Power BI, Spotfire, or Excel.

Culture & Benefits

• Inclusive work environment with a strong commitment to Diversity and Inclusion.
• Access to employee resource groups, including Pride Network and global Women's groups.
• Company goal of increasing women in management positions to 30% by 2030.
• Equal opportunity employer providing reasonable adjustments.