WireBond Engineer (Semiconductors)

TL;DR

WireBond Engineer (Semiconductors): Managing end-to-end process and equipment performance for Die Bond and Wire Bond stations in a Reel-to-Reel assembly line with an accent on equipment uptime, process stability, and yield improvement. Focus on conducting DOE and FMEA to resolve quality issues and leading New Product Introduction (NPI) activities.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a leading semiconductor manufacturer focused on high-volume production and quality excellence.

What you will do

• Own and sustain Die Attach and Wire Bond processes to ensure stable operation and high OEE.
• Manage tooling setup, calibration, alignment, and qualification activities.
• Resolve quality issues such as die tilt, voids, ball offset, and wire lift using DOE, FMEA, and root cause analysis.
• Optimize bonding parameters and validate process capability (Cpk) for existing and new products.
• Lead New Product Introduction (NPI), including setup, conversion, and buy-off.
• Analyze manufacturing data (UPH, yield, downtime) using Spotfire, Power BI, and Excel.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, or Mechatronics Engineering.
• 2–3 years of hands-on experience in Die Bond and/or Wire Bond processes within semiconductor backend manufacturing.
• Strong understanding of R2R assembly lines and high-volume production environments.
• Knowledge of DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze production data using Excel, Spotfire, or Power BI.

Culture & Benefits

• Inclusive and accessible recruitment process for all applicants.
• Strong commitment to diversity and inclusion, with a goal of 30% women in management by 2030.
• Opportunity to join employee resource groups, including Pride Network and Women's groups.
• Safe work environment with reasonable adjustments provided upon request.