Sr. Product Package Solution Engineer (Semiconductors)

Location: Tokyo (Onsite)

Company

hirify.global is a leading global semiconductor manufacturer specializing in secure connectivity and automotive solutions.

What you will do

• Lead packaging projects for New Product Introduction (NPI) and New Technology Introduction (NTI) within the Package Innovation R&D team.
• Coordinate activities across marketing, IC design, applications, test, assembly engineering, and manufacturing.
• Execute packaging deliverables to ensure product timelines and time-to-market goals are met.
• Lead complex technical discussions with internal and external stakeholders across multiple countries.
• Translate product requirements into specific packaging specifications, reliability targets, and cost parameters.

Requirements

• Bachelor's or Master's degree in Material Science or Electrical Engineering.
• At least 10 years of experience in semiconductor IC packaging.
• Proven project management experience.
• Proficiency in risk assessment, risk mitigation, and 8D problem-solving skills.
• Knowledge of leadframe-based, laminate substrate, flip chip, and Wafer Level Chip Scale Packaging platforms.
• Fluent verbal and written English and Japanese skills are required for communication with global teams and local customers.

Nice to have

• Understanding of foundry processes, assembly processes, and failure analysis.
• PMP and Six Sigma certifications.