Test Back-End Manufacturing Engineer (Semiconductor)

TL;DR

Test Back-End Manufacturing Engineer (Semiconductor): Managing WIP movement and optimizing manufacturing workflows for semiconductor test back-end operations with an accent on OEE, OTD, and shipment targets. Focus on automating reporting via Power BI and SQL, leading 5S activities, and improving high-volume manufacturing efficiency.

Location: Kuala Lumpur, Malaysia

Company

A global leader in semiconductor solutions.

What you will do

• Plan daily WIP movement to meet Scan Out, Pack Out, OEE, and shipment targets.
• Establish recovery and improvement plans to meet TBE KPIs, including delivery outs and OTD.
• Collaborate with cross-functional teams including planners, process, and maintenance personnel to achieve manufacturing goals.
• Optimize manufacturing workflows to improve efficiency, reduce waste, and enhance product quality.
• Develop interactive Power BI dashboards and automate routine reports using SQL and Power Automate.
• Lead 5S activities and serve as the Lead Safety Champion for TBE Operations.

Requirements

• Bachelor's Degree in Engineering (Manufacturing, Electrical, Industrial, or IT/Computer Science).
• Experience in semiconductor manufacturing processes, preferably in High Volume Manufacturing (HVM).
• Proficiency in MS Office, SQL, and reporting/automation tools.
• English and Bahasa Malaysia: Good command of written and spoken language required.
• Location: Must be based in Kuala Lumpur, Malaysia.

Culture & Benefits

• Focus on ownership, speed of execution, and a results-oriented mindset.
• Culture of innovation and adaptation to new trends and technologies.
• Collaborative environment focused on shared goals and trust.
• Opportunity to hold leadership roles in safety and 5S initiatives.