Process Sustaining Manager (Die Attach/DACA Engineering)

TL;DR

Process Sustaining Manager (Die Attach/DACA Engineering): Leading the process engineering team to sustain Die Attach manufacturing processes with an accent on yield, quality, and cost performance. Focus on driving defect reduction, improving process capability through DOE and SPC, and managing cross-functional problem solving.

Location: Seremban

Company

hirify.global is a leading semiconductor company specializing in essential components for a wide range of electronic applications.

What you will do

• Lead and mentor the process engineering team.
• Own and optimize process yield and quality performance.
• Drive defect reduction initiatives and cross-functional problem solving.
• Lead DOE, SPC, and Process Capability improvement efforts.
• Support NPI (New Product Introduction) and customer qualification.
• Improve cycle time and overall manufacturing productivity.

Requirements

• Bachelor's or Master's Degree in Engineering.
• 8–10 years of experience in semiconductor assembly.
• Strong expertise in Die Attach processes.
• Proficiency in Six Sigma, DOE, SPC, and FMEA.
• Prior leadership experience is preferred.

Culture & Benefits

• Commitment to diversity and inclusion, with a goal of 30% women in management by 2030.
• Inclusive and accessible recruitment process.
• Access to employee resource groups, such as the Pride Network Group and Women's groups.
• Safe work environment with reasonable adjustments provided upon request.