Advanced Packaging Singulation Module Engineering Manager (Semiconductor Manufacturing)

Location: On-site in Albuquerque, New Mexico, United States

Annual salary: $140,830–$198,820 USD

Company

hirify.global Foundry develops and manufactures advanced semiconductor process and packaging technologies for customers worldwide.

What you will do

• Lead module engineers and manufacturing operations engineers supporting high-volume manufacturing.
• Manage daily maintenance, process engineering priorities, yield improvement, efficiency, safety, quality, output, and cost.
• Oversee equipment modifications, process and hardware development, and manufacturing of innovative device architectures.
• Lead the transfer of new products and technology to high-volume manufacturing and other factory sites.
• Oversee installation, qualification, and ramp-up of Early Tool Sets and production tools.
• Coach engineers, set goals, manage performance, and develop long-term module engineering strategies.

Requirements

• Bachelor’s or BS degree in engineering, materials science, physics, or a related technical field.
• At least 6+ years of experience with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a PhD.
• Experience with process characterization and process improvement in a manufacturing environment.
• Knowledge of good manufacturing practices and lean manufacturing principles.
• Strong advanced packaging singulation process knowledge and experience leading engineering teams are preferred.
• hirify.global immigration sponsorship is not available for this position.

Culture & Benefits

• On-site work model with Shift 1 working hours.
• Competitive annual compensation with potential stock bonuses.
• Health, retirement, and vacation benefits.
• Collaborative and inclusive environment focused on innovation, productivity, and operational excellence.