Engineer, Process (Semiconductor)

TL;DR

Process Engineer (Semiconductor): Developing, optimizing, and implementing Die Attach/Clip Attach (DACA) processes for semiconductor manufacturing with an accent on process capability and cost reduction. Focus on utilizing DOE and SPC for process improvement, qualifying new equipment, and supporting New Product Introduction (NPI).

Location: Cabuyao, Philippines (Onsite)

Company

hirify.global is a global semiconductor manufacturer focused on providing essential components for a wide range of electronic applications.

What you will do

• Develop and optimize new processes to increase efficiency and cost-effectiveness at assigned stations.
• Qualify and release new equipment platforms and process technologies.
• Conduct machine and process capability studies using data analysis to drive improvements.
• Implement process improvement strategies utilizing DOE, SPC, and other statistical methods.
• Maintain critical process documentation, including FMEA, OCAP, and control plans.
• Support NPI activities, customer product qualifications, and sample builds.

Requirements

• Bachelor's Degree in Mechanical, Electronics, Mechatronics, Materials Engineering, or a related discipline.
• Minimum 4 years of experience in Process Engineering or NPI within semiconductor assembly.
• Practical experience in Die Attach/Clip Attach; knowledge of Solder Dispense, Solder Print, and Reflow is an advantage.
• Proficiency in statistical tools such as SAS JMP or Minitab.
• Strong knowledge of SPC, DOE, FMEA, and DFM.
• Ability to work in a fast-paced manufacturing environment.

Culture & Benefits

• Competitive salary and comprehensive benefits package.
• Clear opportunities for professional development and career growth.
• Strong commitment to workplace safety and employee well-being.
• Innovative and dynamic work environment.
• Inclusive culture with dedicated employee resource groups (e.g., Pride Network, Women's groups).