Module Development Engineer (Semiconductor)

TL;DR

Module Development Engineer (Semiconductor): Developing and sustaining advanced planarization techniques for semiconductor manufacturing with an accent on physics, materials science, and surface science. Focus on optimizing manufacturing processes, conducting feasibility studies, and enabling rapid miniaturization of integrated circuits.

Location: Must be based on-site in Hillsboro, Oregon, USA

Salary: $133,800–$188,890 USD

Company

hirify.global is a global leader in computing technology, driving innovation in semiconductor manufacturing and AI-era silicon solutions.

What you will do

• Develop and sustain chemical mechanical planarization (CMP) techniques for diverse materials and architectures.
• Drive technology development for high-volume manufacturing and future roadmap enablement.
• Perform feasibility studies through theoretical simulations and practical engineering methods.
• Partner with equipment and materials suppliers to implement enabling technology elements.
• Optimize manufacturing processes, equipment metrology, and system designs to meet rigorous specifications.
• Conduct pathfinding activities to support innovative device architecture manufacturing.

Requirements

• PhD degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry, or a related STEM field.
• Focus on hands-on experimental research during academic or professional tenure.
• Ability to work on-site in Hillsboro, Oregon.
• Strong foundation in semiconductor device physics and process integration.
• Demonstrated ability to construct clear data-based problem statements.
• Must be able to start within 12 months.

Nice to have

• Experience with Statistical Process Control (SPC) or Design of Experiments (DOE).
• Proficiency in data analysis tools such as MATLAB, Excel, or JMP.
• Knowledge of semiconductor processing fundamentals like lithography, etching, and film deposition.
• Experience with physical device characterization (SEM, TEM).

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and time-off policies.
• Opportunity to work on cutting-edge semiconductor technology at a global scale.
• Collaborative environment with diverse scientific backgrounds.