Engineering Manager (Semiconductor)

TL;DR

Engineering Manager (Semiconductor): Leading a team of process integration, yield, and defect reduction engineers to support high-volume manufacturing of advanced packaging technologies with an accent on defect reduction roadmaps and parametric monitoring. Focus on solving complex manufacturing challenges, implementing data-driven solutions, and ensuring delivery against foundry customer commitments.

Location: Must be based in Albuquerque, New Mexico (Onsite role)

Salary: $140,830–$231,670 USD

Company

A global leader in semiconductor manufacturing, technology development, and advanced packaging solutions.

What you will do

• Lead and mentor a team of process integration, yield, and defect reduction engineers.
• Develop and execute comprehensive defect reduction roadmaps to improve yield and product quality.
• Design and implement defect scan strategies, quick-turn analyses, and parametric monitoring systems.
• Collaborate with cross-functional teams including design, materials, product engineering, and HVM operations.
• Build and maintain inline metrics dashboards for critical process modules and manufacturing parameters.
• Drive continuous process improvement using Win It Inline methodologies.

Requirements

• Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, or Chemical Engineering.
• 5+ years of relevant semiconductor manufacturing or advanced packaging experience.
• Proven track record in technology development and technology transfer.
• Strong leadership skills with the ability to influence without formal authority.
• Must be able to work onsite in Albuquerque, New Mexico.
• Not eligible for immigration sponsorship.

Nice to have

• 3+ years of yield analysis and defect reduction methodologies.
• 3+ years of Failure Mode and Effects Analysis (FMEA) experience.
• Deep understanding of integrated semiconductor process flows and process interactions.
• Knowledge of defect metrology tools and capabilities.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health and retirement benefit programs.
• Paid vacation and time-off policies.
• Opportunity to work on cutting-edge silicon and packaging technology for the AI era.