Package Development Senior Manager (Semiconductor)

TL;DR

Package Development Senior Manager (Semiconductor): Leading backend assembly and package platform development with an accent on technology roadmaps and mass production execution. Focus on resolving technical challenges, driving cross-functional collaboration, and coaching team members to enhance technical capability.

Location: Seremban, Malaysia (Onsite)

Company

A leading semiconductor company focusing on innovative package development and assembly solutions.

What you will do

• Define and execute strategic technology roadmaps for package platforms and backend assembly aligned with business objectives.
• Lead the development and qualification of assembly packaging solutions from initial concept to mass production.
• Clear technical roadblocks for teams to ensure the successful achievement of project goals.
• Deliver reliable, manufacturable, and cost-effective package solutions to maintain a competitive advantage.
• Drive cross-functional collaboration and identify future-ready assembly technologies for long-term growth.
• Manage stakeholders and coach team members to develop their technical competence and career growth.

Requirements

• Bachelor’s or Master’s degree in Engineering.
• At least 10 years of experience in the semiconductor industry.
• Minimum of 3 years of experience in a managerial capacity.
• Comprehensive knowledge of assembly processes, BOM, design, and equipment technologies.
• Proficiency in package design rule review, Thermal and stress FEA simulation, DFMEA, PFMEA, DFx, and AutoCAD.
• Strong leadership skills and a proven ability to coach others.

Culture & Benefits

• Inclusive and accessible recruitment process emphasizing diversity and equal opportunity.
• Support for employee resource groups, including the Pride Network and global/local Women's groups.
• Strong commitment to gender diversity with a goal of 30% women in management by 2030.
• Safe work environment with reasonable adjustments provided upon request.