Senior Packaging Engineer (Semiconductor)

TL;DR

Senior Packaging Engineer (Semiconductor): Supporting mass production of multi-die wirebond leadframe packages at an OSAT partner with an accent on sustaining manufacturing performance and supplier process control. Focus on implementing RTM protocols, driving SPC, and leading root-cause analysis for yield excursions.

Location: Onsite in Penang, Malaysia (Resident at OSAT partner site)

Company

hirify.global is a leading provider of high-voltage power conversion and semiconductor solutions.

What you will do

• Act as the on-site technical owner and primary interface between OSAT operations and internal packaging/product teams.
• Troubleshoot daily production issues, resolve yield excursions, and lead root-cause analysis using 8-D and RCA methodologies.
• Implement and maintain RTM artifacts, including process flows, control plans, work instructions, and SOPs.
• Define and drive SPC, including control charts, capability studies (Cp/Cpk), and guardbanding for critical assembly steps.
• Manage supplier change control (PCNs), BOM releases, and perform periodic quality audits at the OSAT site.
• Conduct process characterization and DOE to optimize yield, quality, capacity, and cycle time.

Requirements

• B.S. in Electrical, Mechanical, Materials, Chemical engineering or a related discipline.
• Minimum 2 years’ experience in semiconductor back-end assembly with volume production experience.
• Practical knowledge of wirebond processes, leadframe design, clip bonding, plating, and molding/encapsulation.
• Proficiency in problem-solving using 8-D, FMEA, DOE, and SPC.
• Experience with QC/FA tools such as cross-section, decap, SEM, and X-ray, and the ability to interpret FA reports.
• Must be based full-time at the OSAT site with occasional travel to the Penang operations hub.

Nice to have

• Experience producing power packages or automotive qualification work.
• Knowledge of AEQ Automotive reliability requirements and APQP development processes.
• Familiarity with JEDEC/IPC standards.
• Ability to collaborate with colleagues in US timezones.