Mechanical Tooling Engineer (Semiconductor)

TL;DR

Mechanical Tooling Engineer (Semiconductor): Designing and deploying advanced tooling and hardware solutions for semiconductor packaging with an accent on precision engineering, CAD modeling, and GD&T application. Focus on developing manufacturing processes, performing feasibility studies, and optimizing equipment to enable next-generation device architectures.

Location: On-site in Phoenix, Arizona

Salary: $133,800–$255,200 USD

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Lead the design and development of sophisticated manufacturing processes and tooling solutions.
• Perform feasibility studies and theoretical simulations to support hardware development.
• Apply GD&T standards to mechanical component and tooling designs.
• Partner with equipment and material suppliers to implement enabling technology elements.
• Optimize operating equipment to improve production efficiency and manufacturing techniques.
• Conduct pathfinding activities to support innovative device architecture roadmaps.

Requirements

• Master’s degree in Mechanical Engineering, Mechatronics, or Physics with 4+ years of experience, or PhD with 2+ years of experience.
• Proficiency in solid modeling CAD tools such as Creo, SolidWorks, or AutoCAD.
• Expertise in Geometric Dimensioning & Tolerancing (GD&T).
• Proven experience in tooling, fixtures, or precision hardware development.
• Must be authorized to work in the US without sponsorship.
• Must be able to work on-site in Phoenix, Arizona.

Nice to have

• Experience with thermal-mechanical tooling design and validation.
• Knowledge of Design for Manufacturability (DFM) and root-cause methodologies.
• Familiarity with MATLAB, FEA modeling, and statistical methodologies like Six Sigma.
• Experience with elastomer socket technology or compliant mechanical interconnect systems.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on industry-leading semiconductor packaging technologies.
• Collaborative cross-functional team environment.