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Module Development Engineer (Semiconductor)

133 800 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle/senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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TL;DR

Module Development Engineer (Semiconductor): Developing and optimizing defect inspection solutions for high-volume semiconductor manufacturing with an accent on process experimentation, metrology, and yield improvement. Focus on designing robust inspection methods, analyzing defect data, and collaborating with cross-functional teams to drive next-generation technology nodes.

Location: Must be based on-site in Hillsboro, Oregon, USA

Salary: $133,800–$188,890 USD

Company

A global leader in semiconductor manufacturing, technology innovation, and advanced packaging solutions.

What you will do

  • Develop and implement advanced defect inspection and metrology technologies for semiconductor manufacturing.
  • Design and optimize processes, inspection methods, and equipment performance using statistical methods.
  • Conduct process experimentation and feasibility studies (DOE, SPC) to drive yield improvements.
  • Analyze defect data to identify root causes and enhance overall product quality.
  • Collaborate with equipment and materials suppliers to introduce and scale new technologies.
  • Support technology pathfinding and roadmap development for future product nodes.

Requirements

  • Bachelor’s degree in Materials Science, Mechanical, Chemical, or Electrical Engineering, Physics, or Chemistry with 4+ years of experience (or Master's with 3+ years, or PhD with 2+ years).
  • Proven experience in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
  • Strong proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Ability to work on-site in Hillsboro, Oregon.
  • Strong analytical, problem-solving, and cross-functional collaboration skills.

Nice to have

  • Experience troubleshooting manufacturing processes and equipment.
  • Background in packaging processes or equipment automation development.
  • Previous work experience in a semiconductor foundry.
  • Project management experience in technology development.

Culture & Benefits

  • Competitive total compensation package including base pay and stock bonuses.
  • Comprehensive health, retirement, and vacation benefit programs.
  • Collaborative, inclusive, and innovation-driven work environment.
  • Opportunities for career growth through challenging technical projects.
  • Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.

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