Process Integration Device Engineer (Semiconductors)

TL;DR

Process Integration Device Engineer (Semiconductors): Leading the development, integration, and transfer of HV/BCD semiconductor technologies with an accent on device physics and foundry collaboration. Focus on optimizing device architecture, analyzing process integration, and ensuring reliability through TCAD simulations and data-driven root-cause analysis.

Location: Shanghai (JingAn)

Company

hirify.global is a global leader in secure connectivity solutions for embedded applications.

What you will do

• Act as the primary technical interface between NXP and external foundries in China for HV/BCD technology projects.
• Define technical specifications and review foundry implementations to ensure alignment with NXP standards.
• Lead the development and optimization of HV/BCD device architectures including LDMOS, EDMOS, and ESD.
• Analyze process integration deviations and their impact on performance, yield, and reliability.
• Utilize TCAD simulations to accelerate development cycles and perform root-cause analysis.
• Collaborate with internal business, design, and engineering teams to drive projects to completion.

Requirements

• Master’s or Ph.D. in Electrical Engineering, Solid-State Physics, or Materials Science.
• 10+ years of semiconductor industry experience in process integration or device engineering.
• Profound knowledge of HV and BCD technologies.
• Hands-on experience with TCAD tools (Sentaurus / Silvaco).
• Fluent in English and Mandarin required.
• Strong experience in technology development or transfer projects with foundries.

Nice to have

• Familiarity with JMP data analysis software.
• Experience with Cadence design tools.