Staff/Principal Package R&D Engineer

TL;DR

Staff/Principal Package R&D Engineer (Semiconductor Packaging): Own the functionality and performance of semiconductor products as a package architect, while supporting OSATS and interfacing with global package and assembly development communities. Focus on technical first-level onsite support, leading small technical projects, and solving complex thermomechanical and performance challenges based on customer needs, market trends, and benchmarking.

Location: Seremban

Company

hirify.global develops semiconductor technology and operates in-house production.

What you will do

• Own package functionality and performance as the package architect for semiconductor products.
• Provide technical first-level support onsite and support OSATS technically.
• Lead small technical projects and propose innovative technical solutions.
• Interface with global package and assembly development communities.
• Collect technical customer needs, market trends, and benchmarking information.
• Support Business Group functions with package expertise.

Requirements

• Master’s degree or PhD in Semiconductor Packaging, Chemistry, Physics, Materials Technology, Mechanical Engineering, or a related field.
• Fluent Business English.
• Strong leadership skills and a proactive mindset.
• Strong architectural thinking, critical judgment, and fast, structured problem solving.
• Excellent communication skills and ability to work in a global, intercultural environment.

Nice to have

• Experience with thermomechanical simulation.
• Mandarin language skills.

Culture & Benefits

• Permanent employment contract with attractive remuneration and social benefits.
• Training and development opportunities.
• Work in an engaged multi-cultural team with a global footprint.
• Moderate travel to other hirify.global sites globally and to OSATS.

Hiring process

• Recruitment is based on hirify.global vacancies; job adverts are not intended for talent acquisition via other channels.