Thermal Data Analysis Engineer

TL;DR

Thermal Data Analysis Engineer (Thermal/CFD/FEA): Drive thermal design and analysis for GPUs, AI accelerators, and data center products using simulation and hands-on experimental work with an accent on thermal requirements across silicon, package, and platform levels. Focus on correlating laboratory data with simulations, optimizing thermal performance, and developing next-generation thermal characterization and metrology methodologies.

Location: US, Arizona, Phoenix

Salary: $164,470.00–$232,190.00 USD (annual)

Company

hirify.global develops semiconductor and platform technologies for computing and AI workloads.

What you will do

• Develop packaging thermal solutions for GPU and AI products, including advanced packaging approaches such as chiplets and multi-chip modules.
• Run thermal simulations and analyses and perform thermal–electrical–mechanical co-design optimization to meet product performance objectives.
• Design and execute laboratory experiments to characterize thermal performance from advanced packages to system-level cooling solutions.
• Build and validate thermal metrology/measurement techniques, including methods for two-phase cooling and microchannel heat spreaders.
• Correlate experimental results with simulation outputs to improve predictive modeling accuracy and support thermal characterization test plans.
• Partner with silicon, packaging, platform, and system engineering teams and communicate findings to internal and external stakeholders.

Requirements

• PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related field; or a Master’s degree in one of these disciplines with 2+ years of experience in thermal engineering/thermal sciences.
• 2+ years of experience using thermal simulation tools such as CFD and/or FEA.
• 2+ years of experience in thermal characterization, validation, and experimental testing in a laboratory environment; or 2+ years applying heat transfer principles to thermal management for electronic/semiconductor/data center/high-performance computing products.
• Ability to translate simulation and experimental findings into actionable thermal design recommendations.
• Strong verbal and written communication skills for technical and non-technical audiences.

Culture & Benefits

• On-site work model required.
• Total compensation includes competitive pay, stock bonuses, and benefits such as health, retirement, and vacation.
• Annual salary range provided for US locations; final pay depends on work location and experience.

Hiring process

• Application review and consideration for employment based on qualifications.
• Recruiter shares location-specific compensation details during the hiring process.