Package Application Engineer (Engineering)

TL;DR

Package Application Engineer (Engineering): Developing and optimizing product packing methods to meet functional requirements and EIA/IEC standards with an accent on material design and manufacturing excellence. Focus on mitigating technical risks through FMEA and simulation analysis while ensuring quality across the development lifecycle.

Location: Onsite in Seremban, Malaysia

Company

hirify.global is a leading semiconductor manufacturer specializing in discrete components and logic devices.

What you will do

• Develop optimal packing designs, including carrier tape, labels, and MBB, in accordance with hirify.global requirements and EIA/IEC standards.
• Identify technical risks and provide mitigation proposals using Design FMEA and Fitting Simulation Analysis.
• Drive sound and effective control methodologies for product packing processes.
• Own and manage material design change control for packaging components.
• Ensure packing materials are effectively implemented throughout the entire development life cycle.
• Collaborate with procurement and supplier quality to assess supplier technology capabilities.

Requirements

• Degree in Engineering, Materials Science, or a related field (Master's degree preferred).
• Knowledge of IC/discrete package design.
• Experience with design tools such as Simulation, Design FMEA, and CAD.
• English: B2 level required (good command of written and spoken English).
• Willingness to travel occasionally.

Nice to have

• Experience in solder footprint design.
• Proficiency in Putonghua.
• Experience in handling customers.

Culture & Benefits

• Equal-opportunity employer with a strong commitment to diversity and inclusion.
• Inclusive and accessible recruitment process for all applicants.
• Participation in employee resource groups, including the Pride Network and Women's groups.
• Company goal to increase women in management positions to 30% by 2030.
• Safe work environment with reasonable adjustments available upon request.