Assembly Backend Process Engineer (Semiconductor)

TL;DR

Assembly Backend Process Engineer (Semiconductor): Supporting and optimizing backend assembly processes for automotive-grade packages with an accent on quality, yield improvement, and cost efficiency. Focus on maintaining process documentation, driving cross-functional collaboration to resolve technical risks, and implementing statistical process control.

Location: Kuala Lumpur, Malaysia (Onsite)

Company

hirify.global is a global leader in secure connectivity solutions for embedded applications, with a significant manufacturing presence in Malaysia.

What you will do

• Support and improve backend assembly processes for assigned semiconductor packages.
• Drive activities related to quality, yield enhancement, and cost reduction.
• Manage process documentation, specifications, standard work instructions, and OCAP.
• Collaborate with cross-functional teams to resolve conflicts and mitigate risks.
• Take ownership of assigned deliverables while working closely with peers and management.

Requirements

• Bachelor's Degree in Engineering (Material Science, Electrical, Mechanical, or equivalent).
• 1-2 years of experience in semiconductor assembly, specifically for automotive customers.
• Strong interpersonal, leadership, and problem-solving skills.
• Proficiency in Microsoft Office (Excel Macros, PowerPoint, Word) and AutoCAD.
• Knowledge of SPC and statistical process control methods.

Nice to have

• Project management knowledge.

Culture & Benefits

• Opportunity to work in a global semiconductor manufacturing environment.
• Focus on continuous learning and professional development.
• Collaborative team culture with an emphasis on driving improvement and success.