обновлено 8 дней назад
Failure Analysis Engineer (Power MOSFET)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Failure Analysis Engineer (Power MOSFET): Investigating wafer- and package-level MOSFET failures using electrical characterisation, microscopy, X-ray, LIT, SAM, SEM, EDX and FIB techniques with an accent on failure mechanisms, device physics and reliability analysis. Focus on correlating analytical results with process, design and lifetest data, producing scientifically defensible reports, and supporting 8D, root-cause analysis and cross-functional quality improvements.
Location: Manchester, United Kingdom; hybrid and flexible working available.
Company
develops and manufactures advanced semiconductor technologies, including high-volume power MOSFET products.
What you will do
- Investigate MOSFET devices at wafer and package level using electrical characterisation, optical microscopy, X-ray, LIT, SAM, SEM, EDX and FIB cross-sectioning.
- Identify failure mechanisms including EOS/ESD, process and material defects, and application-driven stress.
- Correlate analytical findings with process data, design information and reliability lifetest results.
- Communicate conclusions across Quality, Manufacturing, R&D, Reliability, Applications and Customer Engineering teams.
- Prepare scientifically defensible reports with images, graphs and schematics, and contribute to 8D and root-cause analysis activities.
- Develop laboratory capabilities, support equipment upkeep, mentor junior colleagues and contribute to preventive quality improvements.
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics or a related field.
- Experience or strong academic exposure to semiconductor devices, preferably power MOSFETs, failure analysis, reliability or product engineering.
- Knowledge of device physics, semiconductor manufacturing processes and reliability mechanisms.
- Strong scientific writing, presentation and technical communication skills.
- Structured problem-solving mindset, curiosity and strong attention to detail.
- Confidence working in cross-functional, multicultural environments.
Nice to have
- Hands-on failure analysis experience with power semiconductor devices.
- Familiarity with reliability stress standards and application-driven failure modes.
Culture & Benefits
- Hybrid and flexible working with 33 days of annual leave.
- Annual Incentive Plan of up to 6%, contributory pension scheme of up to 9%, income protection and life assurance.
- Funded academic support up to PhD level and management or technical development pathways.
- On-site medical centre, enhanced sick pay, subsidised canteen, employee assistance programme and flexible benefits.
- Inclusive employee resource groups, reasonable adjustments and paid time off for charitable work.
Hiring process
- Recruiter review.
- Technical interview covering failure analysis methods, device physics and case studies.
- Competency interview.
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