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Power Integrity Engineer - Advanced Packaging

120 300 - 160 400RON
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
Romania
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Power Integrity Engineer - Advanced Packaging (High-Speed Semiconductor Packaging): Developing and characterizing electrical designs for advanced IC packages supporting 448 Gb/s data rates and beyond with an accent on signal and power integrity, electromagnetic modeling, and manufacturability. Focus on channel simulations, power-plane analysis, package layout collaboration, and solving high-speed signaling challenges across 2.5D/3D packaging technologies.

Location: Bucharest, Romania

Base pay: 120,300–160,400 RON per annum, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions and data infrastructure technologies for enterprise, cloud, AI, and carrier architectures.

What you will do

  • Design, model, and characterize electrical channels for high-speed semiconductor packages supporting data rates of 448 Gb/s and beyond.
  • Optimize signal integrity while accounting for manufacturing and assembly tolerances.
  • Collaborate with package layout designers to ensure manufacturability, performance, reliability, and cost compliance.
  • Work with marketing and IC designers to define achievable package specifications.
  • Contribute to the development of new package technologies, including multi-chip and advanced package configurations.

Requirements

  • Bachelor’s degree in Electrical Engineering and at least 1 year of related professional experience.
  • Strong knowledge of circuit theory, electromagnetics, transmission lines, microwave theory, signal integrity, and power integrity.
  • Experience with 2D and 3D electromagnetic simulation tools such as Ansys HFSS, SIWave, Cadence Clarity, PowerDC, PowerSI, XtractIM, or Keysight ADS.
  • Experience with frequency- and time-domain high-speed signaling, channel simulations, power-plane design, modeling, and analysis.
  • Familiarity with IC package or PCB layout tools, packaging technologies, materials, substrate design rules, and assembly rules.
  • Good verbal and written English, with strong teamwork, communication, presentation, and documentation skills.

Nice to have

  • Experience with 2.5D or 3D package development.
  • Working knowledge of Spectre, ADS, HSpice, or Ansys Electronics Desktop Circuit Design.

Culture & Benefits

  • Collaborative, transparent, and inclusive work environment.
  • Access to tools and resources supporting professional growth and development.
  • Eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
  • Employment may require eligibility to access technology and software subject to U.S. export control laws and regulations.

Hiring process

  • Interviews assess individual experience, thought process, and communication skills in real time.
  • AI tools, transcription apps, automated answer generators, and automated note-taking bots are not permitted during interviews.

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