Power Integrity Engineer - Advanced Packaging

TL;DR

Power Integrity Engineer - Advanced Packaging (SI/PI): Developing advanced semiconductor IC package PDN with an accent on power integrity optimization under manufacturing and assembly tolerances. Focus on electrical design, EM modeling and characterization for high-speed signaling (448 Gb/s and beyond) while coordinating with layout, IC designers, and marketing to deliver achievable package specifications.

Location: Bucharest, Romania

Salary: 152,700 - 203,600 RON per annum

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier architectures.

What you will do

• Own package development including electrical design, modeling, and characterization of advanced packaging PDN with a focus on power integrity.
• Optimize power integrity while accounting for manufacturing and assembly tolerances.
• Interface with package layout design to ensure manufacturability and meet performance, reliability, and cost requirements.
• Collaborate with marketing and IC designers to define achievable package specifications and contribute to new package technology development.

Requirements

• Bachelor’s degree in Electrical Engineering with 3–5 years of experience, or Master’s/PhD in Electrical Engineering with 1–3 years of experience.
• Strong fundamentals in electrical circuits theory, electromagnetics (EM), transmission lines, microwave theory, and signal & power integrity.
• Hands-on experience with 2D/3D EM simulation tools (e.g., Ansys SIWave, Cadence Clarity/PowerDC/PowerSI/XtractIM, Keysight ADS).
• Knowledge of frequency-domain and time-domain high-speed signaling.
• Experience with channel simulations using MATLAB, ADS, or similar tools.
• Good English knowledge (verbal and written).

Nice to have

• Experience with power plane design, modeling, and power integrity analysis.
• Familiarity with IC package/PCB layout tools (e.g., Cadence APD, Mentor PADS, Xpedition Package Designer).
• Experience with 2.5D/3D package development.
• Working knowledge of circuit design tools (e.g., Spectre, ADS, HSpice, Ansys Electronics Desktop Circuit Design).
• Ability to automate SI/PI/packaging activities using scripting (Python, Skill, TCL).

Culture & Benefits

• Competitive compensation and benefits.
• Collaborative, transparent, and inclusive work environment.
• Support and resources to grow and develop.

Hiring process

• Interviews evaluate individual experience, thought process, and communication in real time.
• No use of AI tools during interviews (including transcription/answer generators/automated note-taking) to avoid disqualification.