обновлено 1 месяц назад
Power Integrity Engineer - Advanced Packaging
120 300 - 160 400RON
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Power Integrity Engineer - Advanced Packaging (High-Speed Semiconductor Packaging): Developing and characterizing electrical designs for advanced IC packages supporting 448 Gb/s data rates and beyond with an accent on signal and power integrity, electromagnetic modeling, and manufacturability. Focus on channel simulations, power-plane analysis, package layout collaboration, and solving high-speed signaling challenges across 2.5D/3D packaging technologies.
Location: Bucharest, Romania
Base pay: 120,300–160,400 RON per annum, plus eligibility for bonus and equity plans.
Company
develops semiconductor solutions and data infrastructure technologies for enterprise, cloud, AI, and carrier architectures.
What you will do
- Design, model, and characterize electrical channels for high-speed semiconductor packages supporting data rates of 448 Gb/s and beyond.
- Optimize signal integrity while accounting for manufacturing and assembly tolerances.
- Collaborate with package layout designers to ensure manufacturability, performance, reliability, and cost compliance.
- Work with marketing and IC designers to define achievable package specifications.
- Contribute to the development of new package technologies, including multi-chip and advanced package configurations.
Requirements
- Bachelor’s degree in Electrical Engineering and at least 1 year of related professional experience.
- Strong knowledge of circuit theory, electromagnetics, transmission lines, microwave theory, signal integrity, and power integrity.
- Experience with 2D and 3D electromagnetic simulation tools such as Ansys HFSS, SIWave, Cadence Clarity, PowerDC, PowerSI, XtractIM, or Keysight ADS.
- Experience with frequency- and time-domain high-speed signaling, channel simulations, power-plane design, modeling, and analysis.
- Familiarity with IC package or PCB layout tools, packaging technologies, materials, substrate design rules, and assembly rules.
- Good verbal and written English, with strong teamwork, communication, presentation, and documentation skills.
Nice to have
- Experience with 2.5D or 3D package development.
- Working knowledge of Spectre, ADS, HSpice, or Ansys Electronics Desktop Circuit Design.
Culture & Benefits
- Collaborative, transparent, and inclusive work environment.
- Access to tools and resources supporting professional growth and development.
- Eligibility for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
- Employment may require eligibility to access technology and software subject to U.S. export control laws and regulations.
Hiring process
- Interviews assess individual experience, thought process, and communication skills in real time.
- AI tools, transcription apps, automated answer generators, and automated note-taking bots are not permitted during interviews.
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