Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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$99к-157к/год
$110к$130кмедиана$170к
По похожим ролям (50) ~ $130к/год
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Четкая рольВысокая зарплатаОриентация на людейТребование на месте
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Signal Integrity/Power Integrity (SI/PI) Design Engineer (High-Speed Connectivity): Designing electrical packages for custom photonic, analog, and digital ICs supporting next-generation optical modules with an accent on signal integrity, power integrity, RF performance, and advanced package structures. Focus on simulating and optimizing package designs, coordinating silicon floor plans and package pinouts, and driving verification, tapeout, and manufacturing-related decisions.
Location: New Providence, New Jersey, United States
Annual salary: $98,600–$157,400
Company
hirify.global builds high-speed connectivity infrastructure and networking technology supporting the AI era.
What you will do
Lead electrical package design for custom in-house photonic, analog, and digital ICs supporting next-generation optical modules.
Simulate and optimize signal integrity, power integrity, and RF performance using package design and electromagnetic simulation tools.
Define advanced package selection, new product BGA configurations, and package structures.
Own package and SIP layout, optimization, design verification, and tapeout.
Coordinate with cross-functional engineering groups on package selection, feasibility analysis, silicon floor plans, bump layouts, and package pinouts.
Work with contract manufacturers and vendors on existing designs and future product development.
Requirements
Bachelor’s degree in Electrical Engineering or Physics.
At least 2 years of hands-on IC package design experience.
Fluency with SI/PI and electromagnetic simulation tools such as SIWave and HFSS.
Thorough understanding of signal and power integrity fundamentals.
Nice to have
Master’s or PhD in Electrical Engineering or Physics.
Substrate design experience for RF, digital, high-speed, and mixed-signal die.
Proficiency with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD); Cadence experience is highly preferred.
Experience with package design electrical reviews and SI/PI analysis.
Experience with package design for manufacturing reviews.
Familiarity with package substrate technologies, including 2.5-D IC and 3-D IC interposers.
Strong problem-solving skills and engineering fundamentals.
Culture & Benefits
Flexible work and development opportunities supporting professional growth and well-being.
Medical, dental, and vision plans.
401(k) participation with company matching in the United States.
Employee Stock Purchase Program and Employee Assistance Program.
Company-paid holidays, paid sick leave, vacation time, and applicable paid family and other leave.
Discretionary incentive bonus eligibility for non-sales employees.
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