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обновлено 7 дней назад

Signal Integrity/Power Integrity (SI/PI) Design Engineer

98 600 - 157 400$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Signal Integrity/Power Integrity (SI/PI) Design Engineer (High-Speed Connectivity): Designing electrical packages for custom photonic, analog, and digital ICs supporting next-generation optical modules with an accent on signal integrity, power integrity, RF performance, and advanced package structures. Focus on simulating and optimizing package designs, coordinating silicon floor plans and package pinouts, and driving verification, tapeout, and manufacturing-related decisions.

Location: New Providence, New Jersey, United States

Annual salary: $98,600–$157,400

Company

hirify.global builds high-speed connectivity infrastructure and networking technology supporting the AI era.

What you will do

  • Lead electrical package design for custom in-house photonic, analog, and digital ICs supporting next-generation optical modules.
  • Simulate and optimize signal integrity, power integrity, and RF performance using package design and electromagnetic simulation tools.
  • Define advanced package selection, new product BGA configurations, and package structures.
  • Own package and SIP layout, optimization, design verification, and tapeout.
  • Coordinate with cross-functional engineering groups on package selection, feasibility analysis, silicon floor plans, bump layouts, and package pinouts.
  • Work with contract manufacturers and vendors on existing designs and future product development.

Requirements

  • Bachelor’s degree in Electrical Engineering or Physics.
  • At least 2 years of hands-on IC package design experience.
  • Fluency with SI/PI and electromagnetic simulation tools such as SIWave and HFSS.
  • Thorough understanding of signal and power integrity fundamentals.

Nice to have

  • Master’s or PhD in Electrical Engineering or Physics.
  • Substrate design experience for RF, digital, high-speed, and mixed-signal die.
  • Proficiency with Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD); Cadence experience is highly preferred.
  • Experience with package design electrical reviews and SI/PI analysis.
  • Experience with package design for manufacturing reviews.
  • Familiarity with package substrate technologies, including 2.5-D IC and 3-D IC interposers.
  • Strong problem-solving skills and engineering fundamentals.

Culture & Benefits

  • Flexible work and development opportunities supporting professional growth and well-being.
  • Medical, dental, and vision plans.
  • 401(k) participation with company matching in the United States.
  • Employee Stock Purchase Program and Employee Assistance Program.
  • Company-paid holidays, paid sick leave, vacation time, and applicable paid family and other leave.
  • Discretionary incentive bonus eligibility for non-sales employees.

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