Principal SI/PI Design Engineer

TL;DR

Principal SI/PI Design Engineer (Hardware/IC): Leading electrical package design for custom photonic, analog, and digital ICs with an accent on signal and power integrity optimization. Focus on advanced package selection, RF performance simulation, and cross-functional collaboration to support next-generation optical modules.

Location: New Providence, NJ (Onsite)

Salary: $157,100–$250,900 USD

Company

A global leader in high-speed connectivity, focused on a people-first culture and innovative technology solutions.

What you will do

• Lead advanced package selection and BGA configuration for custom in-house ICs.
• Manage package/SIP layout, design verification, and tapeout processes.
• Simulate and optimize signal/power integrity and RF performance.
• Coordinate with cross-functional teams to optimize silicon floor plans and package pin-outs.
• Interface with contract manufacturers and vendors for sourcing and development.
• Conduct feasibility analysis for new product package designs.

Requirements

• BS in Electrical Engineering or Physics.
• 5+ years of hands-on experience with IC package design.
• Proficiency in Advanced Package Designer (APD)+SIP or Xpedition Package Designer (XPD).
• Experience with SI/PI and EM simulation tools like SIWave or HFSS.
• Understanding of package substrate technologies including 2.5-D and 3-D IC interposers.
• Strong engineering fundamentals and problem-solving skills.

Culture & Benefits

• Comprehensive medical, dental, and vision plans.
• Participation in 401(K) with company matching.
• Employee Stock Purchase Program (ESPP).
• Paid sick leave, vacation time, and company-paid holidays.
• Commitment to diversity, inclusion, and equal opportunity employment.