Advanced Packaging Design - SI/PI Engineer (Semiconductor Packaging)

Location: On-site 5 days per week in Westborough, MA or Chandler, AZ, United States.

Base pay: $134,400–$198,910 per annum, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions that serve as building blocks for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Analyze signal integrity and power integrity and optimize designs within 2D, 2.5D, and 3D packages.
• Interface with product design teams on floor-planning, package design input, and power delivery network design.
• Perform wiring studies to determine signal routing, verify power delivery, and establish package size.
• Evaluate package and PCB designs against challenging electrical requirements.
• Work closely with physical designers and IP teams to optimize electrical performance.
• Execute simulation tasks for signal and power integrity sign-off.

Requirements

• Interest in semiconductor packaging design and experience with signal and power integrity verification and design optimization.
• Deep knowledge of electrical engineering concepts, circuit extraction, simulation, and design methodologies.
• BS degree in electrical engineering or a related field plus 3+ years of related professional experience in package or PCB design; or MS degree plus 1+ year of related experience; or completed PhD.
• Understanding of signal integrity and power integrity concepts and fundamentals.
• Experience with simulation and analysis using tools such as PowerSI or SIwave, including working knowledge of circuit extraction and simulation.
• Ability to work with engineers across multiple locations and geographies.
• Strong communication, presentation, and documentation skills.

Nice to have

• Experience in package development, including interposer design.
• Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, or Cadence Sigrity.
• Familiarity with packaging technologies, materials, package substrate design rules, and assembly rules.

Culture & Benefits

• Full-time individual contributor role within an advanced packaging design team.
• Employee stock purchase plan with a 2-year look back.
• Eligibility for a new hire equity grant and annual equity refreshers.
• Family support programs, mental health resources, and physical health benefits.
• Recognition and service awards.
• Applicants must be eligible to access export-controlled information under applicable U.S. regulations; some applicants may require export license review.

Hiring process

• Interviews assess individual experience, thought process, and communication skills in real time.
• Use of AI tools during interviews is prohibited unless specifically authorized by the interviewer.