Packaging Module Engineer (Semiconductors)

TL;DR

Packaging Module Engineer (Semiconductors): Designing and developing advanced packaging solutions for semiconductor products with an accent on regulatory compliance, manufacturing efficiency, and scalability. Focus on implementing SPC/DOE techniques, optimizing DFM practices, and conducting risk analysis to ensure optimal product performance and secure global transportation.

Location: On-site in Phoenix, Arizona, USA

Salary: $99,030 – $188,890 USD

Company

hirify.global is a global leader in the semiconductor industry, focusing on state-of-the-art manufacturing and advanced packaging technology for the AI era.

What you will do

• Design, develop, and qualify packaging solutions and materials meeting product and regulatory requirements.
• Lead the full development cycle, from artwork and prototyping to qualification testing and specification documentation.
• Collaborate with manufacturing, logistics, and supply chain partners to align packaging with operational needs.
• Implement cost-saving and waste-reduction measures to enhance process efficiency.
• Perform risk analysis and benchmark designs against industry standards to maintain a competitive edge.
• Manage vendor qualification to ensure manufacturing scalability and high quality.

Requirements

• Master's degree in Engineering, Physics, Chemistry, or a STEM field (1+ years experience) or a PhD (6+ months experience).
• Experience in product packaging assembly processes and production methodologies.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) techniques.
• Strong analytical skills for data analysis and risk assessment.
• Knowledge of Design for Manufacturing (DFM) practices and packaging test criteria.
• Must be able to work on-site in Phoenix, Arizona.

Nice to have

• Experience with Surface Mount Technologies (SMT), solder joint reliability, and package certification.
• Proven track record of leading technical teams and influencing stakeholders in a matrixed environment.
• Familiarity with semiconductor device fabrication and packaging process flows.
• Experience delivering results in time-critical innovation projects.

Culture & Benefits

• Comprehensive compensation package including competitive pay and stock bonuses.
• Full range of benefits including health insurance, retirement plans, and vacation.
• Investment in employee professional growth and development.
• Commitment to ethical hiring practices and responsible business alliance compliance.