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Package Development, Signal Integrity And Power Integrity Engineer, Senior Staff (Semiconductors)

142 700 - 211 230$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Senior Staff Package Development, SI and PI Engineer (Semiconductors): Developing advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates with an accent on electrical design, modeling, and characterization. Focus on signal and power integrity, interfacing with suppliers for manufacturability, and implementing 2.5D/3D packaging technologies.

Location: Austin, TX (Onsite)

Salary: $142,700 - $211,230 per annum

Company

hirify.global provides semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

  • Develop advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
  • Lead package development, electrical design, modeling, and characterization, including all signal and power integrity aspects.
  • Interface with package suppliers to select technology, drive layout, and ensure manufacturability and cost compliance.
  • Collaborate with marketing and IC designers to develop achievable package specifications.
  • Contribute to the development of new package technologies.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Science, or related field with 5-10 years of experience (or Master's/PhD with 3-5 years).
  • Strong fundamentals in EM, transmission lines, and microwave theory.
  • Experience with EM simulation tools such as Ansys HFSS, SI-Wave, or Cadence Clarity.
  • Proficiency in automating SI, PI, and Packaging activities using Python.
  • Working knowledge of circuit design tools like Spectre, ADS, and HSpice.
  • Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Nice to have

  • Experience with 2.5D/3D package development.
  • Experience with CPC/CPO connectors.
  • Experience with channel simulations using MATLAB or ADS.
  • Track record of new product introduction from concept through production.
  • Knowledge of thermal and mechanical analysis of IC package development.

Culture & Benefits

  • Employee stock purchase plan with a 2-year look back.
  • Family support programs to help balance work and home life.
  • Robust mental and physical health resources.
  • Recognition and service awards to celebrate contributions and milestones.
  • Comprehensive benefits supporting employees from internship to retirement.

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