Advanced Packaging Senior Engineer (Semiconductor)

TL;DR

Advanced Packaging Senior Engineer (Semiconductor): Designing and implementing advanced semiconductor IC packages from concept to mass production with an accent on physical implementation and electrical optimization. Focus on evaluating design feasibility, implementing cutting-edge 2.5D/3D packaging technologies, and ensuring design for manufacturing requirements.

Location: Bucharest, Romania

Company

hirify.global provides essential semiconductor solutions for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Evaluate design feasibility based on package topology, design rules, and electrical requirements.
• Perform hands-on physical implementation of semiconductor package designs.
• Collaborate with the electrical simulation team to optimize designs for electrical performance.
• Interact with operations teams and fabrication suppliers to meet design for manufacturing (DFM) requirements.
• Execute layout-related tasks, including tool evaluations, flow development, and library maintenance.

Requirements

• Bachelor’s degree in Electrical Engineering (3-5 years experience) or Master’s/PhD (1-3 years experience).
• Proficiency with IC package or PCB layout tools such as Cadence APD or Xpedition Package Designer.
• Deep knowledge of packaging technologies, materials, substrate design rules, and assembly rules.
• Understanding of advanced 2.5D/3D package technology, including CoWoS-S/R/L, EMIB, CPO, and CPC.
• English: Good spoken and written proficiency required.
• Legal: Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Culture & Benefits

• Competitive compensation and comprehensive benefits package.
• Work environment rooted in shared collaboration, transparency, and inclusivity.
• Access to tools and resources designed for professional growth and development.