Module Development Defect Inspection Engineer (Semiconductor)
Мэтч & Сопровод
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Описание вакансии
TL;DR
Module Development Defect Inspection Engineer (Semiconductor Manufacturing): Driving technology development and process integration for high-volume manufacturing with an accent on defect inspection and equipment solutions. Focus on leading the design of sophisticated manufacturing processes, performing path-finding activities for innovative device architectures, and optimizing production output.
Location: Regular onsite presence required in Hillsboro, Oregon, USA
Salary: $115,110.00 - $219,550.00
Company
A global leader in semiconductor manufacturing and technology, focused on state-of-the-art silicon process and packaging for the AI era.
What you will do
- Drive technology development to enable high-volume manufacturing and meet desired device specifications.
- Lead the design and development of sophisticated manufacturing processes, including material selection and system design.
- Perform path-finding activities to enable innovative device architectures and develop technology roadmaps.
- Implement equipment modifications to improve production efficiency and optimize output for existing products.
- Partner with equipment and material suppliers to implement enabling technology elements.
- Conduct feasibility studies using theoretical simulations and practical engineering methods.
Requirements
- Bachelor's degree in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics, Chemistry, or related STEM field with 5+ years of experience (or Master's with 4+, or PhD).
- Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
- Knowledge of process development methodologies, statistical process control, and manufacturing improvement.
- Technical expertise in module engineering or fab process/hardware technology development.
- Regular onsite presence in Hillsboro, Oregon is mandatory.
Nice to have
- Strong understanding of metrology fundamentals and development experience.
- Experience with packaging processes or equipment automation development.
- Expertise in leveraging data analysis tools for process optimization and continuous improvement.
Culture & Benefits
- Competitive total compensation package including stock bonuses.
- Comprehensive benefit programs covering health, retirement, and vacation.
- Opportunity to innovate and shape the future of semiconductor technology within a dynamic environment.
- Collaborative culture working with cross-functional teams including yield and operations.
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