Назад
Company hidden
15 часов назад

Module Development Defect Inspection Engineer (Semiconductor)

115 110 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/

TL;DR

Module Development Defect Inspection Engineer (Semiconductor Manufacturing): Driving technology development and process integration for high-volume manufacturing with an accent on defect inspection and equipment solutions. Focus on leading the design of sophisticated manufacturing processes, performing path-finding activities for innovative device architectures, and optimizing production output.

Location: Regular onsite presence required in Hillsboro, Oregon, USA

Salary: $115,110.00 - $219,550.00

Company

A global leader in semiconductor manufacturing and technology, focused on state-of-the-art silicon process and packaging for the AI era.

What you will do

  • Drive technology development to enable high-volume manufacturing and meet desired device specifications.
  • Lead the design and development of sophisticated manufacturing processes, including material selection and system design.
  • Perform path-finding activities to enable innovative device architectures and develop technology roadmaps.
  • Implement equipment modifications to improve production efficiency and optimize output for existing products.
  • Partner with equipment and material suppliers to implement enabling technology elements.
  • Conduct feasibility studies using theoretical simulations and practical engineering methods.

Requirements

  • Bachelor's degree in Materials Science, Electrical/Mechanical/Chemical Engineering, Physics, Chemistry, or related STEM field with 5+ years of experience (or Master's with 4+, or PhD).
  • Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
  • Knowledge of process development methodologies, statistical process control, and manufacturing improvement.
  • Technical expertise in module engineering or fab process/hardware technology development.
  • Regular onsite presence in Hillsboro, Oregon is mandatory.

Nice to have

  • Strong understanding of metrology fundamentals and development experience.
  • Experience with packaging processes or equipment automation development.
  • Expertise in leveraging data analysis tools for process optimization and continuous improvement.

Culture & Benefits

  • Competitive total compensation package including stock bonuses.
  • Comprehensive benefit programs covering health, retirement, and vacation.
  • Opportunity to innovate and shape the future of semiconductor technology within a dynamic environment.
  • Collaborative culture working with cross-functional teams including yield and operations.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →