Advanced Packaging Design Engineer (AI)

TL;DR

Advanced Packaging Design Engineer (AI/HPC): Designing next-generation high-performance computing and AI packaging solutions with an accent on 2.5D/3D configurations and advanced substrates. Focus on substrate and PCB layout, high-speed interface routing, and signal/power integrity optimization.

Location: Chandler, AZ (Onsite). Applicants must be eligible to access export-controlled information under U.S. export control laws (EAR).

Salary: $142,700 - $211,230 per annum

Company

hirify.global develops semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Generate advanced packaging solutions using substrate or PCB design tools such as APD or Xpedition.
• Develop floor-planning and architectural routing for various interfaces through package substrates and interposers.
• Design high-speed interface solutions for HBM, DDR, SERDES, PCIe, and Die2Die.
• Collaborate with cross-functional engineering teams across multiple global locations and geographies.
• Utilize SI/PI concepts and techniques to optimize signal routing and system performance.

Requirements

• Bachelor's degree in Electrical Engineering or related field with 5+ years of professional experience, or a Master's/PhD with 3+ years of experience.
• Proven experience in package or PCB layout.
• Deep knowledge of semiconductor packaging technologies, materials, and design processes.
• Experience with high-speed interfaces (HBM, DDR, SERDES, PCIe, Die2Die).
• Basic understanding of SI/PI concepts.
• Eligibility to access export-controlled information as defined under applicable U.S. law.

Culture & Benefits

• Employee stock purchase plan with a 2-year look-back.
• Comprehensive financial well-being and family support programs.
• Robust mental and physical health resources to prioritize well-being.
• Recognition and service awards to celebrate professional milestones.