APTM Advanced Packaging Dry Etch Development Manager

TL;DR

APTM Advanced Packaging Dry Etch Development Manager: Lead plasma etch technology development for Foveros Direct, Foveros, and EMIB packaging solutions with an accent on plasma physics, etch system optimization, and high-volume manufacturing processes. Focus on formulating process roadmaps, driving yield improvements, defect reduction, and seamless technology transfer to production.

Location: On-site presence required in Hillsboro, Oregon, US

Salary: $180,770 - $255,200

Company

hirify.global Foundry, delivering state-of-the-art semiconductor process and advanced packaging technology leadership for the AI era.

What you will do

• Lead and manage a team of process engineers with goal setting, performance management, and coaching.
• Formulate long-term process roadmaps to meet future advanced packaging requirements.
• Oversee development of production-worthy dry etch processes for high-volume manufacturing.
• Drive yield improvement initiatives, defect reduction, and technical excellence in the etch team.
• Develop project schedules, track milestones, and ensure cross-functional collaboration.
• Partner with integration and manufacturing teams for technology transfer and manufacturing excellence.

Requirements

• Master’s or PhD in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or related field
• 10+ years relevant experience with Master’s (8+ with PhD)
• Plasma physics experience and hands-on work with etch platforms (ICP, CCP, RIE systems).
• Project management experience including schedules, deliverables, and cross-functional collaborations.
• Experience in the semiconductor industry.

Nice to have

• Ability to build and lead effective, inclusive teams.
• Experience with vendor relations and material quality assessments.
• Strong knowledge of DOE principles, problem-solving, and package interconnect technologies.

Culture & Benefits

• Competitive pay, stock bonuses, health, retirement, and vacation benefits.
• Focus on innovation, technical excellence, and talent development.
• Opportunity to influence hirify.global's technology roadmap and leadership in advanced packaging.