Senior Principal Engineer (Advanced Packaging)

TL;DR

Senior Principal Engineer (Advanced Packaging): Developing next-generation package architectures for AI XPUs and networking solutions with an accent on signal, power, and thermal integrity. Focus on architecting 2.5D/3D packaging, optimizing chiplet topologies, and collaborating with OSATs/foundries to ensure volume readiness.

Location: Chandler, AZ; Austin, TX; Santa Clara, CA. Applicants must be eligible to access export-controlled information under U.S. law.

Salary: $193,700 - $286,600 per annum

Company

hirify.global provides semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, and AI.

What you will do

• Own the packaging technology roadmap for AI XPU, XPU-attach, and Switch.
• Define system-level package architecture, including chiplet topology, interposer/substrate scaling, and power delivery networks.
• Architect and evaluate choices for silicon/glass interposers, EMIB/bridge, hybrid bonding, and 3D stacking.
• Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability.
• Partner with OSATs and Foundry partners to evaluate process capability, manufacturability, yield, and cost.
• Explore emerging technologies and create/protect IP to maximize performance.

Requirements

• Bachelor's degree in Mechanical, Material, or Electrical Engineering with 10+ years of professional experience (or Master's/PhD with 5+ years).
• Deep understanding of advanced 2.5D/3D package technology including CoWoS, EMIB, CPO, and CPC.
• Experience managing substrate and assembly material vendors, OSATs, and foundries.
• Strong knowledge of chip-package interactions, failure mechanisms, thermal, and warpage management.
• Must be eligible to access export-controlled information as defined under U.S. law.

Nice to have

• Proven experience setting technology roadmaps and driving cross-company supplier programs.
• Prior experience in data center AI accelerators, networking silicon, or custom HPC silicon.
• Ability to influence senior stakeholders across architecture, silicon design, and supply chain.
• Knowledge of signal integrity, power integrity, and board/system level integration.

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Comprehensive financial well-being, family support, and mental/physical health resources.
• Recognition and service awards for milestones.
• Commitment to an inclusive workplace regardless of race, color, religion, or status.