Field Application Engineer Intern (Hardware)

TL;DR

Field Application Engineer Intern (Hardware): Supporting the deployment and optimization of high-speed optical interconnect products with an accent on PAM4 DSP, Coherent DSP, and hardware debugging. Focus on reviewing schematics, performing SI/PI simulations, and collaborating with global engineering teams to resolve customer system issues.

Location: Onsite in Shanghai or Suzhou

Company

A leading semiconductor provider creating essential building blocks for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

• Review customer schematic and layout designs for PAM4/Coherent DSP, driver, and TIA in optical modules.
• Perform SI and PI simulations to ensure signal and power integrity.
• Optimize customer products for improved performance in laboratory settings.
• Participate in product bring-up, evaluation, and hardware/software co-debugging.
• Collaborate with senior FAEs and U.S.-based application teams to support customer engagements.
• Create and maintain technical documentation, FAQs, and internal training materials.

Requirements

• Currently pursuing a Master’s or Ph.D. degree in Electronics/Electrical Engineering or a related field.
• Fundamental understanding or research experience in high-speed SerDes (PAM4), TIA, or optical communication systems.
• Ability to commit for a period of 4-6 months or more.
• Strong communication skills and a collaborative mindset.
• Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Culture & Benefits

• Hands-on experience with state-of-the-art 5nm/3nm/2nm process nodes for 112G/224G/448G applications.
• Direct mentorship and technical guidance from experienced FAEs and U.S. engineering teams.
• Exposure to system-level bring-up and industry-leading SerDes DSP technologies.
• Environment of shared collaboration, transparency, and inclusivity.