обновлено 3 дня назад
Field Application Engineer Intern (Hardware)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Field Application Engineer Intern (Hardware) (PAM4/SerDes and Optical Technologies): Supporting customer hardware and software systems involving PAM4 DSP, Coherent DSP, TIA, drivers, and optical modules with an accent on schematic and layout review, signal and power integrity simulations, and lab-based product bring-up. Focus on debugging customer systems, tuning optical products, and evaluating high-speed SerDes solutions for 112G/224G/448G applications.
Location: Onsite internship at offices in Wuhan or Shanghai/Suzhou, China
Company
develops semiconductor solutions for enterprise, cloud, AI, carrier, and optical data infrastructure.
What you will do
- Assist senior field application engineers with customer schematic and layout reviews for PAM4 DSP, Coherent DSP, drivers, and TIAs.
- Support signal integrity and power integrity simulations.
- Tune and optimize customer products in the laboratory under the guidance of experienced engineers.
- Participate in product bring-up, evaluation, performance testing, and hardware/software debugging.
- Support customer-system troubleshooting and contribute to technical documentation, FAQs, and internal training materials.
Requirements
- Pursuing a Master’s or PhD in integrated circuit design, integrated systems, electronic information engineering, or a related field.
- Fundamental understanding or research experience in high-speed analog/mixed-signal SerDes, PAM4, analog TIA, driver chip design, or optical communication systems is preferred.
- Strong willingness to learn, effective communication skills, and a collaborative mindset.
- Availability for an internship of at least 4–6 months.
- Ability to work onsite at the Wuhan or Shanghai/Suzhou offices.
- Eligibility to access technology and software subject to U.S. export control laws may be required; an export license review may apply.
Culture & Benefits
- Hands-on experience with PAM4 and Coherent DSP optical technologies.
- Practical exposure to system-level bring-up and hardware/software co-debugging.
- Mentorship from experienced field application engineers and U.S. engineering teams.
- Exposure to SerDes DSPs in 5nm, 3nm, and 2nm process nodes for 112G, 224G, and 448G applications.
- Successful interns may receive a full-time offer after completing the internship and passing the assessment.
Hiring process
- Interviews assess individual experience, thought process, and communication skills.
- AI tools and automated assistance are not permitted during interviews.
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