Advanced Packaging Senior Staff Manager (AI)

TL;DR

Advanced Packaging Senior Staff Manager (AI): Leading package design and technology development for high-performance computing, AI, and networking solutions with an accent on 2.5D/3D packages and advanced substrates. Focus on coordinating cross-functional teams, managing staffing plans, and optimizing design quality for high-performance CPU and XPU ASICs.

Location: Burlington, VT

Salary: $180,200 - $266,620 per annum

Company

hirify.global provides semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Execute package designs that align with technical requirements and project schedules.
• Set priorities and develop staffing plans for the packaging design layout team.
• Develop standards and tools to improve team efficiency and design quality.
• Negotiate technical requirements with end customers and suppliers.
• Collaborate with leaders and engineers across multiple global geographies.

Requirements

• 3+ years of people management experience.
• Bachelor's degree in Electrical Engineering with 5-10 years of professional experience, or Master's/PhD with 3-5 years of experience.
• Technical expertise in semiconductor-related fields.
• Strong leadership, communication, and stakeholder management skills.
• Must be eligible to access export-controlled information as defined under U.S. export control laws (EAR).

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Comprehensive family support programs to balance work and home life.
• Robust mental and physical health resources.
• Recognition and service awards for contributions and milestones.