Senior Technical Solutions Engineer (Advanced Packaging)

TL;DR

Senior Technical Solutions Engineer (Advanced Packaging): Leading customer success and technical adoption of advanced semiconductor packaging technologies with an accent on customer relationship management and technical consultation. Focus on driving the adoption of 2.5D/3D, chiplets, and HBM solutions while managing the full engagement lifecycle from design award to high-volume manufacturing.

Location: Hybrid (US: Phoenix, Hillsboro, Folsom, Santa Clara, Austin). Must be based in the US; this position is not eligible for immigration sponsorship.

Salary: $160,980 – $311,040

Company

hirify.global Foundry is a leading systems foundry delivering breakthrough silicon process and packaging technologies to enable the world's essential computing systems for the AI era.

What you will do

• Serve as the primary customer interface for key Packaging and Test accounts, building trust and ensuring seamless communication.
• Provide expert technical consultation on packaging solutions, processes, and advanced technology adoption.
• Develop and maintain detailed Statements of Work (SOW) covering requirements, deliverables, and milestones.
• Manage the complete customer engagement lifecycle from design award through high-volume manufacturing.
• Collaborate cross-functionally with Technology Development, Manufacturing, and Operations teams to drive customer success.
• Influence product and technology roadmaps by translating customer feedback and market insights into internal requirements.

Requirements

• Bachelor's degree in Electrical, Materials, Mechanical, or Chemical Engineering, or a related field.
• 8+ years of overall experience in the semiconductor industry.
• 5+ years of experience in Semiconductor Packaging, Assembly/Test, Backend Manufacturing, or customer-facing engineering roles.
• Must have valid US work authorization (no immigration sponsorship available).

Nice to have

• Post graduate degree in a relevant engineering field.
• Experience with Advanced Packaging Technologies including 2.5D/3D, Chiplets, HBM, HSIO, SiP, or Thermal Management.
• Knowledge of DOE, FMEA, yield analysis, and failure analysis methodologies.
• Proven track record in project management and customer-facing roles.
• Flexibility for travel as required.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive benefit programs including health insurance, retirement plans, and vacation.
• Hybrid work model allowing employees to split time between on-site and off-site work.
• Opportunity to work with cutting-edge silicon process and packaging technology for the AI era.