Engineer II (Semiconductor)

TL;DR

Engineer II (Semiconductor): Managing the end-to-end performance of Die Bond and Wire Bond stations in a Reel-to-Reel semiconductor assembly line with an accent on equipment uptime, process stability, and yield improvement. Focus on conducting DOE, FMEA, and root cause analysis to optimize bonding parameters and drive continuous improvement in a high-volume manufacturing environment.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer specializing in essential components for a wide range of electronics.

What you will do

• Own and maintain Die Attach and Wire Bond processes to ensure high OEE and compliance with process specifications.
• Manage tooling setup, calibration, alignment, and qualification activities.
• Conduct DOE, FMEA, and root cause analysis to resolve quality issues such as die tilt, voids, and wire lift.
• Lead New Product Introduction (NPI) activities, including setup, conversion, and buy-off for new products.
• Analyze equipment performance and process data using Spotfire, Power BI, and Excel to enhance productivity.
• Develop SOPs, troubleshooting standards, and provide technical mentoring to technicians and operators.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or a related engineering discipline.
• 2–3 years of hands-on experience in Die Bond and/or Wire Bond process and equipment support within semiconductor backend manufacturing.
• Strong understanding of R2R assembly lines and high-volume production environments.
• Knowledge of DOE, FMEA, SPC, 8D, and process capability (Cpk) analysis.
• Ability to analyze manufacturing data using Excel, Spotfire, or Power BI.

Culture & Benefits

• Inclusive work environment with a strong dedication to diversity and equal opportunity.
• Access to employee resource groups, including the Pride Network and global/local Women's groups.
• Commitment to increasing women in management positions to 30% by 2030.
• Safe work environment with reasonable adjustments provided upon request.