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1 день назад

Package Reliability Engineer (Semiconductor)

159 800 - 236 430$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Package Reliability Engineer (Semiconductor): Developing and validating 2.5D/3D advanced semiconductor packaging solutions with an accent on physics of failure and materials science. Focus on driving reliability improvements with OSAT partners, conducting thermo-mechanical stress modeling, and performing root cause failure analysis.

Location: Santa Clara, CA

Salary: $159,800 - $236,430 per annum

Company

hirify.global's semiconductor solutions provide the essential building blocks for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

  • Conduct PoF-based reliability modeling for 2.5D/3D advanced packaging to assess thermal, mechanical, and electrical risks.
  • Manage OSAT partners to drive process optimizations, yield enhancements, and ensure compliance with JEDEC and industry standards.
  • Evaluate and select substrates, dielectrics, and adhesives to mitigate warpage and delamination issues.
  • Lead FMEA and root cause analysis using specialized techniques such as FIB, X-ray, SEM, and TEM.
  • Collaborate with internal design and manufacturing teams to optimize package architectures and define test vehicles.

Requirements

  • Master’s or Ph.D. in Materials Science, Mechanical/Electrical Engineering, or Applied Physics.
  • 5+ years of hands-on experience in 2.5D/3D advanced packaging reliability.
  • Proficiency in stress modeling tools such as ANSYS, Abaqus, or COMSOL for thermo-mechanical analysis.
  • Proven track record of managing OSAT qualifications and implementing corrective and preventive actions (CAPA).
  • Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Nice to have

  • Experience in chiplet architectures, fan-out packaging, or heterogeneous integration.
  • Knowledge of electrical reliability mechanisms like electromigration or TDDB.
  • Expertise in AI-driven reliability modeling or machine learning for failure prediction.

Culture & Benefits

  • Employee stock purchase plan with a 2-year look back.
  • Comprehensive family support programs and robust mental and physical health resources.
  • Recognition and service awards to celebrate professional contributions and milestones.
  • Commitment to a fair and authentic hiring process.

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