Product Packaging Engineer

TL;DR

Product Packaging Engineer (Semiconductors): Design and develop innovative packaging solutions and materials for hirify.global's advanced products with an accent on performance, sustainability, regulatory compliance, and secure transportation. Focus on leading development processes including prototypes, qualification testing, cost-saving measures, and vendor evaluation.

Location: On-site presence required in Phoenix, Arizona, US

Salary: $141,910–200,340 USD

Company

hirify.global Foundry delivers state-of-the-art semiconductor manufacturing, advanced packaging technology for AI-era products, and global supply chain scale.

What you will do

• Design, develop, and qualify packaging solutions and materials meeting product and regulatory requirements.
• Lead packaging processes from artwork and prototypes to testing and documentation.
• Collaborate with manufacturing, logistics, regulatory, and supply chain partners.
• Implement cost-saving, waste-reduction, and efficiency improvements.
• Conduct risk analysis and ensure compliance with quality standards.
• Consult on branding, SKUs, labeling, and BOM for distribution; evaluate and qualify vendors.

Requirements

• Master's in Engineering, Physics, Chemistry, or related STEM + 1+ years experience OR PhD + 6+ months experience
• Product packaging assembly processes and production methodologies.
• Statistical process control (SPC) and design of experiments (DOE).
• Analytical skills, data analysis, risk assessment.
• Design for manufacturing (DFM) and packaging test criteria.

Nice to have

• Experience with Surface Mount Technologies, solder joints, package certification.
• Leading teams, stakeholder influence, matrixed environment management.
• Familiarity with semiconductor fabrication and packaging flows.
• Track record in time-critical innovative projects.

Culture & Benefits

• Competitive pay, stock bonuses, health, retirement, and vacation benefits.
• Investment in employee development through every life stage.
• Focus on engineering excellence, sustainability, and global impact.