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3 дня назад

Sr. Business Development Manager (China Region, IP: DSP, CPU)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR

Sr. Business Development Manager (China Region, IP: DSP, CPU): Drive IP licensing growth in China with a strong focus on Tensilica DSP and CPU technologies for automotive, AR/VR, mobile, smart speakers, and consumer markets. Focus on identifying business opportunities, managing sales cycles, building software partner ecosystems, and collaborating with sales and FAE teams on technical evaluations and proof-of-concepts.

Location: Shanghai, Beijing (China). Ability to travel within China and internationally.

Company

Leader in semiconductor IP technologies, developing DSP and CPU solutions for high-impact applications.

What you will do

  • Drive Tensilica DSP and CPU IP licensing growth by engaging SoC teams across automotive, AR/VR, mobile, and consumer sectors.
  • Identify new opportunities, expand accounts, and manage full sales cycles while positioning IP against competitors.
  • Build relationships with software vendors in AI/ML, audio/voice, vision/XR, and automotive middleware for partner onboarding and joint solutions.
  • Collaborate with China sales and FAE teams on technical evaluations, benchmarking, and resolving blockers.
  • Develop China-specific go-to-market strategies, monitor trends, and represent at industry events.

Requirements

  • Bachelor’s or Master’s in Electrical Engineering, Computer Engineering, or related.
  • 10+ years in semiconductor IP, DSP/CPU/NPU, SoC design, embedded software, or business development in China.
  • Strong understanding of DSP architectures, signal processing, embedded systems, and AI workloads.
  • Proven success selling semiconductor IP or technical engagements in China.
  • Familiarity with software ecosystems in audio, voice, AI/ML, AR/VR, and automotive.
  • Excellent communication, negotiation, and relationship-building skills.

Nice to have

  • Direct experience with Tensilica DSPs or similar configurable architectures.
  • Existing relationships with China automotive SoC vendors, smartphone/IoT/CE chipmakers, AR/VR/edge-AI developers, and software partners.
  • Understanding of heterogeneous compute, low-power SoC design, or automotive safety (ISO26262).

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