Package Design Engineer

TL;DR

Package Design Engineer (Advanced Packaging): Lead Si/package/PCB/system co-design for photonic fabric BU with an accent on multi-chip SiP packaging, high-speed interfaces, and 2.5D/3D architectures. Focus on package layout, SI/PI optimization, substrate design, and vendor collaboration for reliability and manufacturability.

Location: Santa Clara, CA or Chandler, AZ

Salary: $166,520 - $249,500 per annum

Company

hirify.global’s semiconductor solutions are essential building blocks for data infrastructure in enterprise, cloud, AI, and carrier architectures.

What you will do

• Lead Si/package/PCB/system co-design, collaborating with ASIC and system teams to develop reusable packages across performance points.
• Scope package design feasibility for silicon interposer and substrate in multi-chip SiP.
• Handle package layout including routing, reliability, thermal, mechanical, SI/PI, manufacturability, and high-speed interfaces like HBM, DDR, PCIe, 56G/112G SerDes.
• Plan and execute 2.5D/3D interposer and RDL layouts with netlist management for chiplet assemblies.
• Engage substrate vendors and OSATs for production, assembly, qualification, failure analysis, and innovation in advanced packaging.

Requirements

• BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related.
• 5-10 years in semiconductor packaging design for heterogeneous architectures including silicon interposer and RDL.
• Extensive experience with Cadence APD and MCAD tools like SolidWorks, AutoCAD.
• Knowledge of 2.5D/3D technologies (InFO, CoWoS, FoCoS, EMIB), SI/PI, thermal/mechanical, DFM, reliability.
• Proven vendor/OSAT engagement for manufacturing, yield, assembly.
• Strong analytical, problem-solving, collaboration, project management skills.

Nice to have

• Familiarity with photonics packaging.

Culture & Benefits

• Comprehensive benefits including financial well-being (employee stock purchase plan), family support, mental/physical health resources, recognition awards.
• Opportunity to impact innovation in data infrastructure.