Advanced Packaging Design Staff Engineer

TL;DR

Advanced Packaging Design Staff Engineer (Semiconductors/AI): Leading small project teams to deliver innovative packaging solutions for high-performance computing, AI, and networking with an accent on signal integrity, power delivery networks, and advanced 2.5D/3D technologies. Focus on optimizing multi-chip configurations, ensuring manufacturability, reliability, and performance trade-offs.

Onsite: Burlington, VT; Westborough, MA; or Boise, ID. Must be eligible for U.S. export-controlled information access (U.S. citizens, permanent residents, or protected individuals).

Salary: $121,000 - $179,040 per annum (USD)

Company

hirify.global develops semiconductor solutions for data infrastructure in enterprise, cloud, AI, and carrier architectures.

What you will do

• Lead small project teams of design and simulation engineers to deliver high-quality packaging solutions.
• Interface with package suppliers to select technologies ensuring manufacturability, performance, reliability, and cost.
• Design substrates and boards considering electrical, mechanical, thermal requirements, and design for manufacturing.
• Optimize signal shielding, power distribution, pinouts for package and system needs.
• Collaborate with chip design and simulation teams on signal/power integrity.
• Contribute to tool, process, and flow development, including library maintenance.

Requirements

• Locations: Burlington, VT; Westborough, MA; Boise, ID (onsite)
• U.S. export control eligibility required (U.S. citizen, permanent resident, or protected individual)
• Bachelor’s in electrical engineering or related; 5+ years experience (Master’s/PhD preferred).
• Experience in substrate/board design, design for manufacturing/reliability, electrical performance trade-offs.
• Proven leadership of complex cross-functional projects.
• Basic Cadence Allegro (3DIC/ISP/APD/SiP); understanding of HBM, DDR, SerDes, PCIe, Ethernet.
• Knowledge of signal/power integrity and advanced packaging (CoWoS, EMIB, CPO, CPC).

Nice to have

• Familiarity with Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks.
• Running/interpreting signal/power simulations.
• Strong communication for global stakeholders.

Culture & Benefits

• Comprehensive benefits: financial well-being (employee stock purchase), family support, mental/physical health resources, recognition awards.
• Opportunity to work on innovative, industry-leading packaging technologies.
• Global collaboration across time zones.

Hiring process

• Interviews evaluate experience, thought process, communication (no AI tools allowed).
• Contact HR for accommodations.