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обновлено 7 дней назад

Sr Principal Engineer -SIPI (SI/PI)

154 000 - 286 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Sr Principal Engineer -SIPI (SI/PI): Developing and validating high-speed IP products through package, PCB, test-chip, and evaluation-board SI/PI optimization with an accent on SerDes channels, S-parameter models, and IBIS-AMI simulations. Focus on correlating extraction and simulation results with lab measurements, debugging customer ASICs, and solving complex signal-integrity and power-integrity challenges.

Location: San Jose, California, United States

Annual salary: $154,000–$286,000 for California, plus potential incentive compensation, bonus, equity, and benefits.

Company

hirify.global Design Systems develops technology and advanced high-speed IP products for the semiconductor industry.

What you will do

  • Optimize and verify SI/PI performance for test-chip package designs and evaluation boards.
  • Provide extracted and measured channel models to chip designers in the R&D team.
  • Develop package and PCB SI/PI design guidelines and support customers with SI/PI inquiries.
  • Review customer package and board designs and simulation results, providing feedback to optimize IP performance in ASICs.
  • Run link-performance simulations using S-parameter channel models and IBIS-AMI behavioral models.
  • Debug SI/PI issues in test chips and customer ASICs in the laboratory.

Requirements

  • M.S. or Ph.D. in Electrical Engineering or a similar field.
  • 3+ years of experience, preferably working with high-speed SerDes and PHYs.
  • Good understanding of high-speed SerDes architecture.
  • Hands-on laboratory experience with high-speed oscilloscopes, TDRs, VNAs, spectrum analyzers, and similar instruments.
  • Fluency with 3D and 2.5D extraction tools such as Sigrity Clarity, PowerSI, Ansys HFSS, or SIwave.
  • Experience with IBIS-AMI model simulations and correlating simulation results with laboratory measurements.
  • Good understanding of PCB and FCBGA design rules and requirements.
  • Strong debugging, problem-solving, communication, and presentation skills, including the ability to communicate effectively with customers and internal stakeholders.
  • Fluent English communication skills.

Culture & Benefits

  • Hands-on technical role within the HPP IP R&D Group.
  • Opportunity to contribute to advanced high-speed IP products and customer-facing technical work.
  • Paid vacation and paid holidays.
  • 401(k) plan with employer match.
  • Employee stock purchase plan.
  • Medical, dental, and vision plan options.

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