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2 дня назад

Signal Integrity Engineer (AI)

100 000 - 500 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US/Canada
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Signal Integrity Engineer (AI): Designing and simulating high-speed interconnects and breakout structures for cutting-edge AI hardware with an accent on signal and power integrity. Focus on end-to-end simulations, ASIC packaging, and validating performance against physical hardware for PCIe Gen5+ and GDDR6.

Location: Hybrid; must be based in Santa Clara, CA, Austin, TX, or Toronto, ON

Salary: $100k - $500k

Company

hirify.global is a leading AI technology company developing high-performance RISC-V CPUs and an integrated AI platform.

What you will do

  • Design, extract, and simulate complex breakout structures and board models for both signal and power integrity.
  • Collaborate with internal/external ASIC packaging teams and ODMs to drive the adoption of new interconnect technologies.
  • Perform end-to-end simulations and validate results against physical hardware.
  • Participate in design reviews, providing SI/PI expertise from a broader system perspective.
  • Support post-silicon bring-up and troubleshoot production and field failures.
  • Document design processes and provide knowledge sharing to team members.

Requirements

  • Bachelor’s degree in Electrical Engineering or equivalent.
  • 5+ years of experience in high-speed digital design (PCB or package) at 10Gbps and above (e.g., 100GbE, GDDR6, PCIe Gen5+).
  • Experience with performance metrics such as ICR, ERL, COM, NEXT, and FEXT, and connector technologies (NPO, CPO).
  • Proficiency with PCB ECAD tools, preferably Cadence Allegro.
  • Must be based in or able to work from Santa Clara, CA, Austin, TX, or Toronto, ON.
  • Must be eligible to access U.S. export-controlled technology (compliant with EAR regulations).

Culture & Benefits

  • Highly competitive compensation package.
  • Opportunity to influence the next generation of ASIC packaging and PCB architectures.
  • Hands-on experience with emerging high-speed connector technologies and materials.
  • Collaborative environment focused on curiosity and solving complex technical challenges.

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