Silicon Packaging Engineer (Wireless Communications Solutions)

TL;DR

Silicon Packaging Engineer (Wireless Communications Solutions): Drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products with an accent on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization. Focus on leading package level simulations, technology trade-off decisions, and end-to-end package development processes from design through production.

Location: On-site presence required in Hillsboro, Oregon, US

Salary: $141,910–$200,340 USD (annual)

Company

hirify.global's Wireless Communications Solutions team developing advanced wireless technologies including Wi-Fi, Bluetooth, and emerging standards for seamless connectivity.

What you will do

• Translate product requirements into package architecture specifications and lead technology trade-off decisions
• Lead mechanical and thermal package simulations to address risks and define performance specifications
• Troubleshoot packaging issues, research materials, and develop cost-effective solutions
• Collaborate with silicon, hardware, design, manufacturing, and reliability teams
• Oversee transition to high-volume manufacturing and validate test vehicles

Requirements

• Bachelor's in Mechanical/Electrical Engineering, Materials Science, Physics or related + 4+ years experience (or Master's + 3+ years, PhD + 1+ year)
• 2+ years package assembly technology development
• 2+ years packaging physics (mechanical/thermal) and/or materials experience
• 2+ years package assembly manufacturing and HVM ramp experience
• Strong project management, communication, and problem-solving skills

Nice to have

• Semiconductor device physics and process engineering
• RF component packaging experience
• Testing systems with Matlab/LabView

Culture & Benefits

• Competitive pay, stock bonuses, health, retirement, and vacation benefits
• Opportunities in innovative wireless technology development
• Shift 1 (standard US hours)