Senior Staff CAD Engineer (Multi-die 3DIC & Power)

Location: Santa Clara, CA, United States. Applicants must be eligible to access technology and software subject to U.S. export control laws; export license review may be required before employment.

Salary: $127,630–$191,200 per annum

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Develop and maintain CAD flows and methodologies for multi-die design and power analysis across business units.
• Deploy, support, and run regressions for CAD flows.
• Collaborate with infrastructure teams to integrate flows into the broader CAD framework.
• Explore agentic AI/ML tools and projects for CAD automation.
• Engage weekly with external partners and internal customers on product requirements and EDA tool development.
• Track industry trends, participate in industry events, and contribute to methodology and workflow innovation.

Requirements

• Bachelor’s degree in Computer Science, Electrical Engineering, or a related field with 5+ years of relevant experience, or a Master’s degree/PhD with 3–5 years of experience.
• 3+ years of hands-on physical design and flow development in an ASIC RTL-to-GDS environment.
• Strong proficiency in TCL and Python scripting for CAD flow development.
• Experience with multi-die design, including 2.5D/3D/3.5D die stacking, floorplanning, SOIC hybrid bonding, inter-die extraction, and multi-die analysis.
• Experience with advanced packaging technologies such as CoWoS, EMIB, PIVR, and COUPE, plus interposer routing and SI/PI analysis.
• Experience with power analysis, including RTL power estimation and optimization, clock-gating efficiency, ASIC block power, glitch power, and UPF.

Nice to have

• Experience with 3DIC Compiler, Integrity 3DIC, Fusion Compiler, Innovus, PrimePower, PP-RTL, Empower, Joules, or PowerArtist.

Culture & Benefits

• Agile environment focused on continuous learning, innovation, and collaboration.
• Employee stock purchase plan with a two-year lookback.
• Family support programs and mental and physical health resources.
• Recognition and service awards.
• Comprehensive benefits supporting financial well-being, family support, health, and recognition.

Hiring process

• Interviews assess individual experience, thought process, and communication skills in real time.
• Use of AI tools during interviews is prohibited unless explicitly authorized.