Senior Manager, Product Marketing (Semiconductor Advanced Packaging)

Location: Santa Clara, CA, United States of America. Full-time onsite role with approximately 20% travel. Relocation is not eligible.

Salary: $171,500.00–$236,000.00 per year. Additional compensation may include a bonus and stock award program, as applicable.

Company

hirify.global develops materials science and engineering solutions for semiconductor chips and advanced displays, including equipment used in semiconductor manufacturing.

What you will do

• Develop and execute business and product marketing strategies for semiconductor advanced packaging, heterogeneous integration, backend lithography, and related technologies.
• Evaluate product development investments and lead market analysis, competitive intelligence, and Red Team assessments.
• Support pricing strategies, product introductions, market penetration, profitability, and market share expansion.
• Partner with Engineering, Manufacturing, Sales, field teams, and stakeholders to define, launch, and improve products and translate market requirements into product and technology roadmaps.
• Manage products across the full lifecycle, from concept and introduction through commercialization, maturity, and end-of-life planning.
• Serve as a subject matter expert on industry trends, emerging technologies, customer requirements, and competitive dynamics in the semiconductor advanced packaging ecosystem.

Requirements

• Technical expertise in the relevant field, with broad knowledge of other disciplines within the function.
• Ability to anticipate business and regulatory issues and recommend product, process, or service improvements.
• Experience leading projects with notable risk and complexity and developing project execution strategies.
• Ability to solve unique and complex problems with broad business impact through conceptual and innovative thinking.
• Ability to influence program, project, or service direction and resource allocation within functional policies and industry guidelines.
• Ability to communicate complex ideas, anticipate objections, and persuade senior stakeholders to adopt different points of view.
• Technical knowledge of wafer or wafer bonder; panel PVD or panel etch; semiconductor equipment platforms for PVD, etch, plating, or hybrid bonding; and OSAT.

Culture & Benefits

• Supportive work culture focused on learning, development, career growth, and innovative solutions.
• Health and wellbeing programs and support for personal and professional growth.
• Comprehensive benefits package.
• Regular employee status with potential eligibility for bonus and stock award compensation.
• Equal opportunity employment and accessibility support for the application process.