Summer 2027 Technical Project/Program Management Intern - Master's (Semiconductor)

Location: Santa Clara, CA, United States; onsite work includes a manufacturing cleanroom environment and 10% travel. Relocation is not eligible.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Support global service projects and reporting initiatives within the TKM business.
• Extract, clean, and analyze supply chain data from internal databases using Excel, Tableau, and AI.
• Develop and maintain Tableau dashboards and automated reports covering cost, logistics performance, supplier capacity, and operational efficiency.
• Collaborate with Purchasing, Operations, and cross-functional stakeholders on process improvement, automation, and data-driven optimization.
• Coordinate global TKM cost-saving initiatives, prepare executive-level status reports, and support parallel supplier development plans.
• Contribute to ad hoc supplier management and performance optimization projects.

Requirements

• Master’s degree in Industrial Engineering, Supply Chain Management, Data Science, Statistics, MBA, or a related business field.
• Proficiency in Microsoft Excel, PowerPoint, Python, SQL, and data visualization with Tableau.
• Strong interpersonal skills with an emphasis on building trust.
• Ability to learn quickly and solve problems creatively and analytically.
• Versatility, flexibility, and willingness to work with changing priorities.
• Comfort working in a manufacturing cleanroom environment.
• Good academic standing with a GPA of 3.5 or above on a 4.0 scale is preferred.

Culture & Benefits

• Hands-on experience in supplier management, data analysis, and managerial-level reporting in the semiconductor industry.
• Exposure to cross-functional collaboration and global leadership teams.
• Mentorship and guidance from experienced professionals.
• Supportive work culture focused on learning, development, and career growth.
• Comprehensive benefits package; additional bonus and stock award participation may apply.

Hiring process

• Applications are reviewed on a rolling basis.
• Apply by December 31, 2026; the position may close early based on application volume or candidate selection.